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MEMS
Fabrication of micro scale gas flow rate sensors
Fabricated devices
Equipment
Spin coating the photoresist
ZEP520A photoresist
3000rpm 45sec
Pre bake at 180°C for 3min
Photoresist thickness ~150nm
Spin coater and hot plate
Exposure
15nA current
350uC/sqcm
Electron beam lithography tool used to pattern the mask:JEOL JBX-6300FS
Develop and Cr coating
Developer: 90 sec in Amyl-Acetate
3nm chromium layer
Kurt J. Lesker PVD 75 electron beam deposition system
Liftoff and Reactive Ion etching
Microposit®remover 1165: 80°C - 1 hour
Oxford Instruments Plasmalab 100
-100°C, 20 sccm SF6 , 5 sccm O2
Oxford Instruments Plasmalab 100